Comments (5)
For sure. He was actually my original inspiration for this board.
From my testing so far the boards show little to no damage, especially since they are software limited to 180C. I do hope to make some improvements including better temperature control for future versions.
Stay tuned as I'll write a test sketch to measure and record how many cycles it can withstand before damage occurs.
from solder-reflow-plate.
Nice idea. Unfortunately 3D printer plates aren't meant for the high temperatures needed to reflow solder paste. I have had the suggestion of making removable/replaceable plates though. When I know a little more about the longevity I may design this.
from solder-reflow-plate.
The longevity of the PCBs will be the biggest issue, most PCBs will have a worktime of only tens of hours. Carl Bugeja has tried to do the same.
https://www.youtube.com/watch?v=fbBXPeC-FPQ https://www.youtube.com/watch?v=ZChSbpBbrt4
from solder-reflow-plate.
Maybe a thermocouple taped to the bottom of the heater could help
from solder-reflow-plate.
An alternative would be an external PTC heating plate made out of metal. Already seen some that can reach up to 250°C.
from solder-reflow-plate.
Related Issues (20)
- Issue with debouncing HOT 9
- Concerning the PCB melting issue HOT 3
- Temperature overshoot HOT 1
- Pretty hot C2 HOT 4
- Request update on software for version 3 board HOT 1
- Does the OLED display require external pullup resistors? HOT 3
- [Suggestion] Replacable heating surface HOT 5
- [Suggestion] Isolated frame around heating surface
- [Question - higher heating power]
- Question HOT 1
- Please provide the code for V3.0 HOT 1
- No mention of compatible solder pastes in main readme HOT 3
- Heating board/component board HOT 1
- [Suggestion] Use same common footprints as much as possible. HOT 1
- Burning bootloader with Arduino gives me Device signature error HOT 3
- Software does not advance HOT 1
- Any plans to design bigger boards?
- Lower temperature control HOT 1
- D1 component position
- If anyone wants to build and compile V3.0 with the ATmega4809 chip using an FT232R Breakout HOT 1
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from solder-reflow-plate.