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InnoComm SN10-12 Sigfox Breakout Board

This breakout board connects your Arduino, Raspberry Pi and other devices to the Sigfox IoT network for low-power, long-range communications. The board uses the InnoComm SN10-12 module to connect to the Sigfox network. The interface between the device and the breakout board is based on SPI with 8 pins (3.3V, GND, CS, SDI, SDO, SCLK, AK, RST). A U.FL antenna and a Sigfox network subscription are required.

  • Autodesk EAGLE board and schematic for InnoComm SN10-12 Sigfox Breakout board (Sigfox Zones RCZ2 and RCZ4) are in innocomm-sigfox-breakout.brd and innocomm-sigfox-breakout.sch

  • The PCB design uses 2 layers: Top (layer 1), Bottom (layer 16).

  • Formatted for Seeed Fusion PCB Assembly service, so that you may submit the files from this repository and order the breakout board fully assembled with the onboard components, including the InnoComm Sigfox module:
    https://www.seeedstudio.com/fusion.html

  • All components sourced from Seeed Open Parts Library (except for InnoComm module) for quicker PCB assembly by Seeed Fusion:
    https://www.seeedstudio.com/opl.html

  • Seeed Open Parts Library for Autodesk EAGLE: (only for the components used)
    Seeed-Capacitor.lbr
    Seeed-Connector.lbr
    Seeed-Inductor.lbr
    Seeed-Resistor.lbr

  • SparkFun Library for Autodesk EAGLE was used for general symbols and components:
    SparkFun-Aesthetics.lbr
    SparkFun-Boards.lbr
    SparkFun-Connectors.lbr
    SparkFun-PowerSymbols.lbr

  • PCB layout was validated in Autodesk EAGLE with the Seeed Fusion Design Rules SeeedStudio_2layer_DRU_no_angle_20140221.dru

  • PCB design was exported from Autodesk EAGLE to Seeed Fusion in Gerber RS-274X and Excellon (drill) formats using the CAM Processor Job Seeed_Gerber_Generater_2-layer.cam. To export:

    1. In EAGLE Board Editor, click File → CAM Processor

    2. At the top of the CAM Processor window, click the Load Job File icon. Click New CAM Job.

    3. Click Open CAM File. Select Seeed_Gerber_Generater_2-layer.cam.

    4. Click Export As ZIP

    5. Under Gerber → Options → Output Type, select Gerber RS-274X.

    6. Click Process Job. This creates a ZIP file that may be uploaded directly to Seeed Fusion.

  • To export the Bill Of Materials (BOM) for uploading to Seeed Fusion:

    1. In EAGLE Board Editor, click File → Export Partlist. Enter partlist.csv as the filename.

    2. We will use the first 2 columns of partlist.csv:
      Part: Contains the Designator e.g. C1
      Value: Contains 3 values - Description / Manufacturer Part Number / SKU (i.e. the Seeed Open Parts Library SKU number) like this: 33pf / CC0402JRNPO9BN330 / 302010000

    3. Open the file innocomm-sigfox-breakout-bom.csv in Excel. Populate the 3 columns: Designator, Manufacturer Part Number, Quantity like this:

      Designator,Manufacturer Part Number,Quantity
      C1,CC0402JRNPO9BN330,1
      C2,TAJC476K006RNJ,1
      U1,SN10-12,1
      ...
      

      We will provide a URL for Seeed Fusion to source for the InnoComm SN10-12 module.

    4. Save the CSV file for uploading to Seeed Fusion. Check innocomm-sigfox-breakout-bom.csv for the BOM that I have submitted to Seeed Fusion.

Seeed Fusion PCB Manufacturing and Assembly

Order submitted to Seeed Fusion for PCB manufacturing and assembly at https://www.seeedstudio.com/fusion_pcb.html:

  1. innocomm-sigfox-breakout_YYYY-MM-DD.zip: PCB design in Gerber RS-274X and Excellon (drill) formats

  2. PCB Specifications:

    1. Base Material FR-4 TG130
    3. No. of Layers 2 layers
    2. PCB Dimensions 25.4 mm * 28.5mm
    4. PCB Quantity (Enter quantity)
    5. No. of Different Designs 1
    6. PCB Thickness 1.6
    7. PCB Color Green
    8. Surface Finish HASL
    9. Minimum Solder Mask Dam 0.1mm
    10. Copper Weight 1oz.
    11. Minimum Drill Hole Size 0.3mm
    (In EAGLE Board Editor, click
    Tools → Statistics → Drill / Hole → VIA Drill)
    12. Trace Width / Spacing 4/4 mil
    (In EAGLE Board Editor, click
    Tools → Statistics → Board → Minor → Wire Width)
    13. Blind or Buried Vias No
    14. Plated Half-holes / Castellated Holes No
    15. Impedance Control No
  3. innocomm-sigfox-breakout-bom.csv: PCB Assembly Bill Of Materials (BOM) for Sigfox Zones RCZ4 and RCZ4

  4. Link provided to Seeed Fusion for sourcing InnoComm SN10-12:
    https://www.arrow.com/zh-cn/products/sn10-12/innocomm-mobile-technology-corporation

References

  1. Original PCB design for Wisol Sigfox Breakout Board:
    https://github.com/lupyuen/Wisol-WSSFM10R-Sigfox-Breakout/tree/master/Hardware

  2. Why I created the breakout board:
    https://medium.com/@ly.lee/making-my-first-ever-pcb-with-seeed-fusion-pcb-assembly-service-9af5736016b3

  3. List of all Sigfox Zones and the countries covered:
    http://makers.sigfox.com/about/

  4. "InnoComm SN10-12 SIGFOX Module Product Specification": Available from InnoComm website upon registration.

  5. "Wisol WSSFM10R H/W Design Guide": For ESD protection circuit. Available from Wisol website upon registration.

InnoComm SN10-12 Sigfox Breakout board

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