xrun: Cannot load image, XCore 0 is not enabled

[Yarulik]

xrun: Cannot load image, XCore 0 is not enabled

[Yarulik]

hink/16SoundsUSB/Firmware/16SoundsUSB_Firmware_REV_1_0.xe
xrun: Cannot load image, XCore 0 is not enabled

think@think-ThinkPad-T470p:~/XMOS/xTIMEcomposer/Community_14.3.3$ xflash --list-devices

Available XMOS Devices

ID Name Adapter ID Devices

---

0 XMOS XTAG-3 hNwmAqzA O[0]

[doumdi]

Maybe this will help : https://www.xmos.com/developer/support/knowledgebase/why-do-i-get-cannot-load-image-xcore-0-not-enabled

[vrheaume]

Hello Yarulik,

First of all, thank you for your interest in our project.

The RST should stay LOW for 140ms immediately after power-up, and then stay HIGH in order to let the XMOS boot up. The RST will also be LOW whenever you press the reset switch. The signal is active-low (processor resetting when low, working when high).

One thing to note: it is absolutely critical to solder the "thermal pad" that is under the XMOS processor properly. The only connection to ground on the XMOS processor is the thermal pad itself (there are no ground "pins").

We have definitely had problems programming the XMOS processor when the thermal pad was not soldered properly (although I cannot remember the error message that we encountered); therefore I would have a look at this first (problem number 7 in the link @doumdi provided).

In this case of the thermal pad not being soldered properly, we had another symptom: peculiar transients would appear on the 3V3 and 1V0 rails during powerup; I would be able to recognize these symptoms if you can send an oscilloscope screenshot.

What technique did you use to solder the XMOS processor to the board? If you're unsure that the thermal pad is properly soldered, I would advise desoldering the chip with a hot air gun, cleaning the pads with braid, applying solder to the thermal pad, resoldering just the thermal pad with the hot air gun, and then hand-soldering the rest of the pins.

I hope this helps. Let us know!

Vincent